US Patent Issued to LAPIS Technology on Aug. 12 for "Semiconductor device and semiconductor device testing method" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,969, issued on Aug. 12, was assigned to LAPIS Technology Co. Ltd. (Yokohama, Japan).

"Semiconductor device and semiconductor device testing method" was invented by Tomomi Miyano (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first semiconductor chip including a first internal circuit, first flip-flop circuits connected to the first internal circuit, first selectors, and first electrodes connected to an output of the first selector; first connection conductors; and a second semiconductor chip including second electrodes connected to the first electrode via the first connection conductor and a second...