US Patent Issued to Lam Research on Sept. 9 for "Methods and systems for managing byproduct material accumulation during plasma-based semiconductor wafer fabrication process" (California Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,736, issued on Sept. 9, was assigned to Lam Research Corp. (Fremont, Calif.).

"Methods and systems for managing byproduct material accumulation during plasma-based semiconductor wafer fabrication process" was invented by Leonid Belau (Pleasanton, Calif.), Alexei Marakhtanov (Albany, Calif.), Eric Hudson (Berkeley, Calif.) and John Patrick Holland (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer is supported on a wafer support structure such that a lower peripheral open region exists between a peripheral portion of a bottom surface of the wafer and an edge ring structure. The edge ring structure is configured to circumscribe ...