ALEXANDRIA, Va., Sept. 23 -- United States Patent no. D1,094,488, issued on Sept. 23, was assigned to LAM RESEARCH Corp. (Fremont, Calif.).
"Manifold for supplying coolant to components of substrate processing systems" was invented by Miguel Benjamin Vasquez (Portland, Ore.).
The patent was filed on Dec. 10, 2021, under Application No. D/818,936.
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