US Patent Issued to LAM RESEARCH on Oct. 28 for "Apparatus for processing a wafer, and method of controlling such an apparatus" (Austrian Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,644, issued on Oct. 28, was assigned to LAM RESEARCH AG (Villach, Austria).

"Apparatus for processing a wafer, and method of controlling such an apparatus" was invented by Martin Kleindienst (Villach, Austria) and Stefan Koch (Villach, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for processing a wafer comprises: a rotatable chuck adapted to receive a wafer; a heating assembly comprising an array of heating elements arranged to heat a wafer received by the rotatable chuck; an image sensor arranged to detect electromagnetic radiation from a surface of the wafer; and a controller configured to control supply of power to the arra...