US Patent Issued to Lam Research on Oct. 21 for "Reducing line bending during metal fill process" (California Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,686, issued on Oct. 21, was assigned to Lam Research Corp. (Fremont, Calif.).

"Reducing line bending during metal fill process" was invented by Anand Chandrashekar (Fremont, Calif.), Lei Guo (San Jose, Calif.), Gang L. Liu (Fremont, Calif.) and Sanjay Gopinath (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of mitigating line bending during feature fill include deposition of a nucleation layer having increased roughness. In some embodiments, the methods include depositing two or more metal nucleation layers."

The patent was filed on March 7, 2022, under Application No. 18/550,190.

*For further information, including images,...