ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,335, issued on Oct. 21, was assigned to Lam Research Corp. (Fremont, Calif.).
"Multi-plate electrostatic chucks with ceramic baseplates" was invented by Feng Wang (Sunnyvale, Calif.), Keith Gaff (Fremont, Calif.) and Christopher Kimball (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck for a substrate processing system is provided. The electrostatic chuck includes: a top plate configured to electrostatically clamp to a substrate and formed of ceramic; an intermediate layer disposed below the top plate; and a baseplate disposed below the intermediate layer and formed of ceramic. The intermediate layer bonds the t...