US Patent Issued to LAM RESEARCH on Oct. 14 for "Mid-ring erosion compensation in substrate processing systems" (California Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,579, issued on Oct. 14, was assigned to LAM RESEARCH Corp. (Fremont, Calif.).

"Mid-ring erosion compensation in substrate processing systems" was invented by Hui Ling Han (Alameda, Calif.) and Seetharaman Ramachandran (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system includes a substrate support assembly to support a semiconductor substrate during processing of the semiconductor substrate in the substrate processing system. A first edge ring is arranged around the substrate support assembly. The first edge ring is movable relative to the substrate support assembly. A second edge ring is arranged around th...