US Patent Issued to Lam Research on Nov. 25 for "Reduced diameter carrier ring hardware for substrate processing systems" (Oregon Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,210, issued on Nov. 25, was assigned to Lam Research Corp. (Fremont, Calif.).

"Reduced diameter carrier ring hardware for substrate processing systems" was invented by Eric Madsen (Sherwood, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate support for a substrate processing system includes a baseplate, a ceramic layer arranged on the baseplate, and a carrier ring arranged on the ceramic layer. The ceramic layer has a first outer diameter, the carrier ring has a second outer diameter that is less than the first outer diameter, the ceramic layer includes a shoulder that extends from the second outer diameter of the carrier ring to the f...