US Patent Issued to Lam Research on Nov. 18 for "Underlayer for photoresist adhesion and dose reduction" (California Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,638, issued on Nov. 18, was assigned to Lam Research Corp. (Fremont, Calif.).

"Underlayer for photoresist adhesion and dose reduction" was invented by Samantha S. H. Tan (Newark, Calif.), Jun Xue (Fremont, Calif.), Mary Anne Manumpil (Fremont, Calif.), Jengyi Yu (San Ramon, Calif.) and Da Li (Newark, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure relates generally to a patterning structure including an underlayer and an imaging layer, as well as methods and apparatuses thereof. In particular embodiments, the underlayer provides an increase in radiation absorptivity and/or patterning performance of the imaging layer."

The pate...