ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,943, issued on May 6, was assigned to Lam Research Corp. (Fremont, Calif.).
"Gold through silicon mask plating" was invented by Lee Peng Chua (Beaverton, Ore.), Defu Liang (Wilsonville, Ore.), Jacob Kurtis Blickensderfer (Tualatin, Ore.), Thomas A Ponnuswamy (Sherwood, Ore.), Bryan L. Buckalew (Tualatin, Ore.) and Steven T. Mayer (Aurora, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods are provided for method for etch assisted gold (Au) through silicon mask plating (EAG-TSM). An example method comprises providing a seed layer on a substrate and providing a silicon mask on at least a portion of the seed layer on the substrate....