US Patent Issued to Lam Research on May 20 for "TSV process window and fill performance enhancement by long pulsing and ramping" (Oregon Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,307, issued on May 20, was assigned to Lam Research Corp. (Fremont, Calif.).

"TSV process window and fill performance enhancement by long pulsing and ramping" was invented by Jae Shin (Beaverton, Ore.), Joseph Richardson (Sherwood, Ore.), Jeyavel Velmurugan (Portland, Ore.), Thomas Anand Ponnuswamy (Sherwood, Ore.) and Steven T. Mayer (Aurora, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of current; reducing the...