ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,265, issued on May 20, was assigned to Lam Research Corp. (Fremont, Calif.).
"RF immune sensor probe for monitoring a temperature of an electrostatic chuck of a substrate processing system" was invented by Siyuan Tian (Fremont, Calif.), Yuma Ohkura Jr. (San Mateo, Calif.), Changyou Jing (Livermore, Calif.) and Matthew Claussen (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor probe includes an elongated body defining an inner cavity having an inner diameter. A printed circuit board is configured to be fitted within the inner cavity. A first temperature-sensing integrated circuit mounted at a first end of the printed circui...