US Patent Issued to Lam Research on March 25 for "Gapfill of variable aspect ratio features with a composite PEALD and PECVD method" (Oregon, California Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,038, issued on March 25, was assigned to Lam Research Corp. (Fremont, Calif.).

"Gapfill of variable aspect ratio features with a composite PEALD and PECVD method" was invented by Hu Kang (Tualatin, Ore.), Shankar Swaminathan (Beaverton, Ore.), Jun Qian (Sherwood, Ore.), Wanki Kim (Portland, Ore.), Dennis M. Hausmann (Lake Oswego, Ore.), Bart J. van Schravendijk (Palo Alto, Calif.) and Adrien LaVoie (Newberg, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided herein are methods and apparatus for filling one or more gaps on a semiconductor substrate. The disclosed embodiments are especially useful for forming seam-free, void-free fill in bo...