US Patent Issued to LAM RESEARCH on June 17 for "Spindle assembly for wafer transfer in a multi-station process module" (Oregon, California Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,375, issued on June 17, was assigned to LAM RESEARCH Corp. (Fremont, Calif.).

"Spindle assembly for wafer transfer in a multi-station process module" was invented by Andrew Borth (Newberg, Ore.) and Jeremy Pool (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A spindle assembly for transferring wafers in a multi-station process module is provided, including: a hub body, the hub body configured to be rotated about a center axis; a plurality of end effectors, each end effector having a first end configured for connection to the hub body and a second end configured to support a wafer; a plurality of covers; a plurality of fastener assemb...