US Patent Issued to Lam Research on June 17 for "In-situ wafer thickness and gap monitoring using through beam laser sensor" (California Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,042, issued on June 17, was assigned to Lam Research Corp. (Fremont, Calif.).

"In-situ wafer thickness and gap monitoring using through beam laser sensor" was invented by Goon Heng Wong (Pleasanton, Calif.), Xuefeng Hua (Foster City, Calif.), Anthony Paul Van Selow (Santa Clara, Calif.), Daniel Torres (San Jose, Calif.) and Jack Chen (San Francisco).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system for determining a thickness of a substrate arranged in a processing chamber includes an emitter configured to transmit a signal toward a gap between the substrate and a component of the processing chamber arranged above the substrate, a receiver conf...