US Patent Issued to Lam Research on June 17 for "Edge removal for through-resist plating in an electro-plating cup assembly" (Oregon Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,421, issued on June 17, was assigned to Lam Research Corp. (Fremont, Calif.).

"Edge removal for through-resist plating in an electro-plating cup assembly" was invented by Bryan L. Buckalew (Tualatin, Ore.) and Stephen J. Banik (Happy Valley, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electroplating cup assembly comprises a cup bottom, a lip seal, and an electrical contact structure. The cup bottom at least partially defines an opening configured to allow exposure of a wafer positioned in the cup assembly to an electroplating solution. The lip seal is on the cup bottom and comprises a sealing structure extending upwardly along an inner ed...