US Patent Issued to Lam Research on July 8 for "Ultrathin atomic layer deposition film accuracy thickness control" (American, Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,871, issued on July 8, was assigned to Lam Research Corp. (Fremont, Calif.).

"Ultrathin atomic layer deposition film accuracy thickness control" was invented by Jun Qian (Sherwood, Ore.), Hu Kang (Tualatin, Ore.), Adrien LaVoie (Newberg, Ore.), Seiji Matsuyama (Toyama, Japan) and Purushottam Kumar (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for depositing films by atomic layer deposition using aminosilanes are provided."

The patent was filed on March 22, 2023, under Application No. 18/188,325.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2...