ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,752, issued on Jan. 27, was assigned to LAM RESEARCH AG (Villach, Austria).
"Apparatus for processing a wafer-shaped article" was invented by Michael Brugger (Millstatt, Austria), Burkhart Schier (Klagenfurt, Austria) and Michael Duller (Treffen, Austria).
According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus for processing a wafer-shaped article, the apparatus comprising a support configured to support the wafer-shaped article during a processing operation; wherein: the support comprises a support body and a plurality of gripping pin assemblies adapted and positioned relative to the support body for gripping the wafer-shaped article, wherein each ...