US Patent Issued to Lam Research on Jan. 13 for "Arcing reduction in wafer bevel edge plasma processing" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,434, issued on Jan. 13, was assigned to Lam Research Corp. (Fremont, Calif.).

"Arcing reduction in wafer bevel edge plasma processing" was invented by Xuefeng Hua (Foster City, Calif.), Wei Yi Luo (Fremont, Calif.) and Jack Chen (San Francisco).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for processing a bevel edge of a wafer in a bevel plasma chamber. The method includes receiving a pulsed mode setting for a RF generator of the bevel plasma chamber. The method includes identifying a duty cycle for the pulsed mode, the duty cycle defining an ON time and an OFF time during each cycle of power delivered by the generator. The meth...