US Patent Issued to Lam Research on Feb. 3 for "Plasma-exclusion-zone rings for processing notched wafers" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,259, issued on Feb. 3, was assigned to Lam Research Corp. (Fremont, Calif.).

"Plasma-exclusion-zone rings for processing notched wafers" was invented by Xuefeng Hua (Foster City, Calif.), Jack Chen (San Francisco), Gnanamani Amburose (Fremont, Calif.), Dan Zhang (Fremont, Calif.), Chang-Wei Huang (Yongkang Dist. Tainan, Taiwan) and Chia-Shin Lin (Shilin Dist., Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plasma-exclusion-zone ring for a substrate processing system that is configured to process a substrate includes a ring-shaped body, an upper portion of the ring-shaped body, a base and a plasma-exclusion-zone ring notch. The upper portion ...