US Patent Issued to Lam Research on Feb. 11 for "Low temperature manifold assembly for substrate processing systems" (California Inventor)

ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,224,161, issued on Feb. 11, was assigned to Lam Research Corp. (Fremont, Calif.).

"Low temperature manifold assembly for substrate processing systems" was invented by Gabriel De Jesus Soto (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manifold assembly for a processing chamber in a substrate processing system includes a manifold. The manifold includes a first valve assembly configured to flow a liquid coolant at a first temperature from a first channel of a coolant assembly to the processing chamber. The first valve assembly is configured to flow the liquid coolant at a cryogenic temperature. The manifold further includes a first we...