ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,392,047, issued on Aug. 19, was assigned to Lam Research Corp. (Fremont, Calif.).
"Byproduct removal from electroplating solutions" was invented by Joseph Richardson (Sherwood, Ore.), Jae Shin (Beaverton, Ore.), Jeyavel Velmurugan (Portland, Ore.), Elizabeth Calora (Beaverton, Ore.), Thomas Anand Ponnuswamy (Sherwood, Ore.) and Steven T. Mayer (Aurora, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for electroplating are provided. An electroplating system may include an electroplating cell configured to contain an anode and an electroplating solution, a wafer holder configured to support a wafer within the electroplating cell, a...