ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,915, issued on Aug. 12, was assigned to Lam Research Corp. (Fremont, Calif.).

"Lower plasma exclusion zone ring for bevel etcher" was invented by Keechan Kim (Livermore, Calif.), Jack Chen (San Francisco) and Gregory S. Sexton (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system for processing a substrate includes an upper plasma exclusion zone ring arranged above a substrate during plasma treatment of a bevel edge of the substrate. An upper electrode is arranged above the substrate during plasma treatment. A lower plasma exclusion zone ring is at least partially arranged below the substrate during the plasma...