US Patent Issued to Laird Technologies on July 22 for "Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide" (Massachusetts, Pennsylvania, Ohio Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,291, issued on July 22, was assigned to Laird Technologies Inc. (Chesterfield, Mo.).

"Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide" was invented by Hoang Dinh Do (Canton, Mass.), Robert Howard Boutier Jr. (Westport, Pa.), Jason L Strader (Pepper Pike, Ohio) and Michael S. Plante (Grafton, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergis...