US Patent Issued to L'Air Liquide Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude on Jan. 20 for "Sulfur-containing molecules for high aspect ratio plasma etching processes" (Delaware Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,211, issued on Jan. 20, was assigned to L'Air Liquide Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude (Paris).

"Sulfur-containing molecules for high aspect ratio plasma etching processes" was invented by Nathan Stafford (Newark, Del.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a structure using a patterned mask layer comprises introducing an etching gas containing a sulfur-containing gas into a reaction chamber, converting the etching gas to a plasma, and allowing an etching reaction to proceed between the plasma and the one or more silicon-containing films so that the one or more silicon-containing...