US Patent Issued to Kyushu University National University, NGK INSULATORS on June 24 for "Copper alloy assembly and production method therefor" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,337,407, issued on June 24, was assigned to Kyushu University National University Corp. (Fukuoka, Japan) and NGK INSULATORS Ltd. (Nagoya, Japan).

"Copper alloy assembly and production method therefor" was invented by Osamu Takakuwa (Fukuoka, Japan), Hisao Matsunaga (Fukuoka, Japan), Takahiro Ishikawa (Toyoake, Japan), Hiromitsu Uchiyama (Agui, Japan), Masato Sakakibara (Handa, Japan) and Masaaki Akaiwa (Handa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A copper alloy bonded body composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another. The copper alloy bonded body has undergone solu...