US Patent Issued to KYUNG DONG ONE on March 25 for "Expanded foam solution and thermosetting expanded foam having excellent flame retardancy using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,434, issued on March 25, was assigned to KYUNG DONG ONE Corp. (Seoul, South Korea).

"Expanded foam solution and thermosetting expanded foam having excellent flame retardancy using the same" was invented by Jong Hyun Yoon (Seoul, South Korea), Sang Yun Lee (Seoul, South Korea) and Dae Woo Nam (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an expanded foam solution for forming a thermosetting expanded foam having excellent flame retardancy produced using the same. According to the present disclosure, nanoclay is mixed with a polyol-based compound using ultrasonic waves, an isocyanate-based compoun...