ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,972, issued on Feb. 17, was assigned to KYOTO ELEX Co. LTD. (Kyoto, Japan).
"Conductive adhesive composition" was invented by Takamitsu Arai (Kyoto, Japan), Takayuki Kasugai (Kyoto, Japan), Nobuo Ochiai (Kyoto, Japan) and Satoru Tomekawa (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to an electrically conductive adhesive composition including: a conductive powder (A) and a curable component (B) which has a content of 20 5 parts by mass or more when an amount of the conductive powder (A) is 100 parts by mass; and a phosphoric acid-containing curable component (C) having a general formula of formula (1) or ...