US Patent Issued to Kyoritsu Chemical & Co., HAMAMATSU PHOTONICS on Nov. 18 for "Workpiece cutting method and resin applying device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,147, issued on Nov. 18, was assigned to Kyoritsu Chemical & Co. Ltd. (Tokyo) and HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Workpiece cutting method and resin applying device" was invented by Daisuke Kurita (Tokyo), Yasunobu Matsumoto (Tokyo), Takeshi Sakamoto (Hamamatsu, Japan) and Iku Sano (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A workpiece cutting method includes: a first step of pasting an expandable sheet on a workpiece; a second step of irradiating, after the first step, the workpiece with laser light to form a modified region and expanding the expandable sheet to divide the workpiece into a plurality of chips, and ...