ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,809, issued on May 20, was assigned to KYOCERA Technologies Oy (Espoo, Finland).
"Bond force concentrator" was invented by Elmeri Osterlund (Espoo, Finland) and Hannu Manninen (Espoo, Finland).
According to the abstract* released by the U.S. Patent & Trademark Office: "Herein is provided a method for bonding a first substrate with a second substrate, comprising the steps of: providing a first and a second substrate, and bonding the first substrate and the second substrate together using a rectangular bond force concentrator to form a bond, wherein the first substrate or the second substrate comprises a device. Herein is further provided an apparatus comprising a first substrate a...