ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,154, issued on Oct. 14, was assigned to KYOCERA Corp. (Kyoto, Japan).
"Wiring board" was invented by Hidetoshi Yugawa (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board according to the present disclosure includes a first insulation layer including a first surface, a land located on the first insulation layer and including a second surface, a second insulation layer located at the first surface of the first insulation layer and including a via hole extending over the second surface of the land, and a via-hole electrical conductor located in the via hole. The land includes a plurality of recessed portions on the second surfac...