US Patent Issued to KYOCERA on Oct. 14 for "Circuit substrate and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,153, issued on Oct. 14, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Circuit substrate and method for manufacturing the same" was invented by Motohiro Umehara (Yasu, Japan) and Yoshinori Kubo (Omihachiman, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a circuit substrate including an insulation substrate formed with a plurality of via holes passing through a first main surface and a second main surface and a metal with which the via holes are filled, the first and second main surfaces being opposing main surfaces, comprising forming, in the insulation substrate, the via hole or a non-through hole opening only on t...