US Patent Issued to KYOCERA on Nov. 4 for "Semiconductor substrate, and manufacturing method and manufacturing apparatus of semiconductor substrate" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,033, issued on Nov. 4, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Semiconductor substrate, and manufacturing method and manufacturing apparatus of semiconductor substrate" was invented by Takeshi Kamikawa (Kyoto, Japan), Yuta Aoki (Kyoto, Japan), Kazuma Takeuchi (Kyoto, Japan), Katsuaki Masaki (Kyoto, Japan) and Fumio Yamashita (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A template substrate including a first seed region and a growth restricting region that are aligned in a first direction, and a first semiconductor part positioned above the template substrate are provided, the first semiconductor part includes a first base posit...