US Patent Issued to KYOCERA on Nov. 25 for "Printed wiring board and method for manufacturing printed wiring board" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,155, issued on Nov. 25, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Printed wiring board and method for manufacturing printed wiring board" was invented by Keisaku Matsumoto (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes an insulating layer and a conductor part. The insulating layer includes a cavity perpendicular to a first surface of the insulating layer. The conductor part includes a connection conductor fitted in at least part of the cavity. The cavity includes a first recess provided in an inner wall surface of the cavity. The connection conductor is partially fitted in the first recess. The firs...