US Patent Issued to KYOCERA on Nov. 11 for "Electronic component housing package, electronic device, and electronic module" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,470,200, issued on Nov. 11, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Electronic component housing package, electronic device, and electronic module" was invented by Takahiro Sasaki (Satsumasendai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component housing package includes: an insulating substrate including a main surface; an external connection conductor including a portion exposed at the main surface; and an inner layer conductor located inside of the external connection conductor in a thickness direction of the insulating substrate, in which the external connection conductor includes a protruding portion extending towar...