US Patent Issued to KYOCERA on May 20 for "Multilayer circuit board with offset connection pads and inclined internal conductors for enhanced electrical connectivity" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,306,210, issued on May 20, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Multilayer circuit board with offset connection pads and inclined internal conductors for enhanced electrical connectivity" was invented by Hitoshi Tega (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes an insulating substrate including a wiring conductor and a first resin substrate that is made of a resin different from the insulating substrate and is laminated on the insulating substrate. The first resin substrate has a plurality of internal conductors located from a surface thereof facing the insulating substrate to a surface on a side opposi...