ALEXANDRIA, Va., March 5 -- United States Patent no. 12,245,366, issued on March 4, was assigned to KYOCERA Corp. (Kyoto, Japan).
"Wiring board" was invented by Hidetoshi Yugawa (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes: first and second insulating layers; a first wiring conductor layer located between the first and second insulating layers and including a first via land; a second wiring conductor layer located on the second insulating layer and including a second via land; a via hole penetrating from the upper to lower surfaces of the second insulating layer; and a via conductor located in the via hole and electrically connecting the first second via lands. The via...