ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,277, issued on March 18, was assigned to KYOCERA Corp. (Kyoto, Japan).
"Element substrate, light-emitting element module, and light-emitting device" was invented by Ryota Hasunuma (Higashiomi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An element substrate includes an insulating substrate, electrode wiring located on the insulating substrate, a heat-dissipating member in contact with the insulating substrate, a flexible substrate electrically connected to the electrode wiring, a temperature detecting element located on the flexible substrate, and an adhesive layer. The adhesive layer is located between the temperature detecting element an...