ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,225, issued on July 29, was assigned to KYOCERA Corp. (Kyoto, Japan).
"Wiring board, electronic device, and electronic module" was invented by Seiichirou Itou (Kyoto, Japan) and Reika Nishiuchi (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board including a component mounting portion with an increased strength is provided. In addition, an electronic device and an electronic module with high reliabilities are provided. The wiring board includes a base having a first face and a conductor positioned on the first face. The conductor has a region in which a plurality of first protrusions are positioned on a surface of the conducto...