US Patent Issued to KYOCERA on Feb. 3 for "Silver particles, method for producing silver particles, paste composition, semiconductor device, and electrical and/or electronic components" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,539, issued on Feb. 3, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Silver particles, method for producing silver particles, paste composition, semiconductor device, and electrical and/or electronic components" was invented by Yuya Nitanai (Yokohama, Japan) and Masakazu Fujiwara (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are silver particles including a silver powder and a silver layer that includes primary particles, the primary particles being smaller than the silver powder."

The patent was filed on Aug. 7, 2020, under Application No. 17/636,082.

*For further information, including images, charts and tables, please...