US Patent Issued to KYOCERA on Feb. 10 for "Method for producing silver particles, thermosetting resin composition, semiconductor device, and electrical and/or electronic components" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,830, issued on Feb. 10, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Method for producing silver particles, thermosetting resin composition, semiconductor device, and electrical and/or electronic components" was invented by Yuya Nitanai (Yokohama, Japan) and Masakazu Fujiwara (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a thermosetting resin composition containing: (A) silver particles including secondary particles having an average particle size from 0.5 to 5.0 micro metre, the secondary particles being formed by aggregation of primary particles having an average particle size from 10 to 100 nm; and (B) a thermosett...