ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,486, issued on Dec. 9, was assigned to KYOCERA Corp. (Kyoto, Japan).
"Wiring board" was invented by Hidetoshi Yugawa (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes an insulation resin layer, and a wiring conductor positioned on the insulation resin layer. The wiring conductor includes a first and second underlying metal layers, a wiring metal layer positioned on the second underlying metal layer, a tin layer positioned covering the first underlying metal layer, the second underlying metal layer, and the wiring metal layer, and a silane coupling agent layer positioned covering the tin layer. When the wiring conduc...