US Patent Issued to KYOCERA on Dec. 16 for "Wiring substrate, electronic device, and electronic module" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,083, issued on Dec. 16, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Wiring substrate, electronic device, and electronic module" was invented by Seiichirou Itou (Kyoto, Japan), Yuichiro Ishizaki (Kyoto, Japan) and Haruki Umeki (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes an insulating substrate including a first surface and a wiring conductor located at the insulating substrate, the insulating substrate containing multiple bulk crystallites of SiC with different polytypes. An electronic device includes the wiring substrate described above and an electronic component mounted on the wiring substrate. An el...