US Patent Issued to KYOCERA on Aug. 12 for "Wiring board, package for containing electronic component, electronic device, and electronic module" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,543, issued on Aug. 12, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Wiring board, package for containing electronic component, electronic device, and electronic module" was invented by Takayuki Shirasaki (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a base, a signal conductor, two first ground conductors, a second ground conductor, and connection conductors. The base is composed of a dielectric and includes a first surface and a second surface opposite to the first surface. The signal conductor is disposed on the first surface and extends to an end portion of the base. The two first ground conductors are dis...