ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,212, issued on Oct. 7, was assigned to KURARAY Co. LTD. (Okayama, Japan).
"Resin composition and molded body" was invented by Daisuke Konishi (Ibaraki, Japan), Hiromitsu Sasaki (Ibaraki, Japan), Takumi Hasegawa (Ibaraki, Japan) and Kazumasa Kusudo (Okayama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition containing an ethylene-vinyl acetate copolymer (I) and a hydrogenated block copolymer (II), wherein the hydrogenated block copolymer (II) is a hydrogenated product of a block copolymer (P) containing a polymer block (A) containing a structural unit derived from an aromatic vinyl compound and a polymer block (B) containing 1 t...