ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,597, issued on Jan. 27, was assigned to KURARAY Co. LTD. (Okayama, Japan).
"Polyamide resin composition and molded object thereof" was invented by Naoto Sugai (Tsukuba, Japan) and Takaharu Shigematsu (Tsukuba, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a polyamide resin composition containing 100 parts by mass of a specific polyamide (A), 45 to 120 parts by mass of an inorganic fibrous reinforcing material (B), 25 to 40 parts by mass of at least one phosphinate salt (C) represented by a specific formula, and 2 to 15 parts by mass of a phosphite salt (D), the phosphinate salt (C) and the phosphite salt (D) being contained at a ...