ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,148, issued on Sept. 23, was assigned to Kuprion Inc. (Waterbury, Conn.).
"Thermal management in circuit board assemblies" was invented by Alfred A. Zinn (Palo Alto, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in ther...