ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,562, issued on Oct. 21, was assigned to Kuprion Inc. (Waterbury, Conn.).
"Nanoparticle paste compositions and connections formed therefrom" was invented by Alfred A. Zinn (Palo Alto, Calif.) and Randall M. Stoltenberg (Palo Alto, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Copper nanoparticle paste compositions may be formulated for forming connections that are capable of operating at high temperatures by including a grain growth inhibitor with copper nanoparticles in a suitable amount. Such nanoparticle paste compositions may comprise copper nanoparticles and 0.01-15 wt. % of a grain growth inhibitor or a precursor to a grain growth inhib...