US Patent Issued to Kuprion on Feb. 18 for "Electronics assemblies employing copper in multiple locations" (California Inventor)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,596, issued on Feb. 18, was assigned to Kuprion Inc. (Waterbury, Conn.).

"Electronics assemblies employing copper in multiple locations" was invented by Alfred A. Zinn (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electronic assemblies may be fabricated with interconnects of different types present in multiple locations and comprising fused copper nanoparticles. Each interconnect or a portion thereof comprises a bulk copper matrix formed from fusion of copper nanoparticles or a reaction product formed from copper nanoparticles. The interconnects may comprise a copper-based wire bonding assembly, a copper-based flip chip connectio...