ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,289, issued on March 25, was assigned to KULITE SEMICONDUCTOR PRODUCTS INC. (Leonia, N.J.).
"Sensor header assembly for increased reliability in high-pressure environments" was invented by Alexander A. Ned (Kinnelon, N.J.) and Scott Goodman (Wayne, N.J.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative...